Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Grid systems for printed circuits
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Published |
На языке оригинала
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1210,00
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Terms for printed circuits
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Published |
На языке оригинала
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3859,00
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Sectional specification:single and doublesided printed boards with plain holes
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Published |
На языке оригинала
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1382,00
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Sectional specification:single and doublesided printed boards with plated-through holes
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Published |
На языке оригинала
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1613,00
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Design and use of printed boards
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Published |
На языке оригинала
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2938,00
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Sectional specification for rigid multilayer printed boards
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Published |
На языке оригинала
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3398,00
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Printed boards--Part 10:Specification for flex-rigid double-sided printed boards with through connections
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Published |
На языке оригинала
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2074,00
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Specification for mass laminationpanels (semi-manufactured multilayer printed boards)
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Published |
На языке оригинала
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1382,00
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Test methods of printed boards
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Published |
На языке оригинала
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3629,00
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General rules for rigid copper clad laminates for printed circuits
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Published |
На языке оригинала
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1613,00
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Test methods for rigid copper clad laminates for printed circuits board
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Published |
На языке оригинала
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5875,00
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Phenolic celluloss paper copper clad laminated sheets for printed circuit
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Published |
На языке оригинала
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1210,00
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Composite base copper clad laminated sheets for printed circuits
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Published |
На языке оригинала
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1210,00
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Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
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Published |
На языке оригинала
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1267,00
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Printed circuit board draw
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Published |
На языке оригинала
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1613,00
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Flux for tin soldering
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Published |
На языке оригинала
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2419,00
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The patternes series for artwork master of printed circuits
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Published |
На языке оригинала
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1613,00
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Thin epoxide woven glass fabric copper-clad laminated sheetпјЊ general purpose gradeпјЊ for use in the fabrication of multilayer printed boards
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Published |
На языке оригинала
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1094,00
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Test method for resistance of conductors of printed boards
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Published |
На языке оригинала
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1210,00
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Copper-clad polyimide film laminates for flexible printed circuits
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Published |
На языке оригинала
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1613,00
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