| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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The rule of type designation for discrete semiconductor devices
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
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Published |
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На языке оригинала
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2477,00
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Semiconductor devices―Mechanical and climatic test methods―Part 1: General
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）
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Published |
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На языке оригинала
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1382,00
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Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
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Published |
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На языке оригинала
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1210,00
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Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
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Published |
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На языке оригинала
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1094,00
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Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Published |
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На языке оригинала
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1843,00
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Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
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Published |
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На языке оригинала
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1613,00
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Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
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Published |
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На языке оригинала
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1613,00
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Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
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Published |
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На языке оригинала
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1498,00
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Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM）
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Published |
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На языке оригинала
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3686,00
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Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)
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Published |
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На языке оригинала
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1498,00
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