| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Blank detail-specification for field-effect transistors for case-rated switching application
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Published |
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На языке оригинала
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2477,00
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Blank detail specification for LED numeric displays
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Published |
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На языке оригинала
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1382,00
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Semiconductor devices—Part 5-6: Optoelectronic devices—Light emitting diodes
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Published |
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На языке оригинала
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6221,00
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Micro-electromechanical system technology—Terms
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Published |
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На языке оригинала
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3744,00
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Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
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Published |
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На языке оригинала
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2477,00
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Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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Published |
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На языке оригинала
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1786,00
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Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
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Published |
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На языке оригинала
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2477,00
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Micro-electromechanical systems technology（MEMS） —Description and measurement methods for micro trench and pyramidal needle structures
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Published |
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На языке оригинала
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3456,00
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Test methods of the performances for MEMS piezoresistive pressure-sensitive device
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Published |
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На языке оригинала
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1786,00
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Micro-electromechanical systems technology—Gyroscopes
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Published |
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На языке оригинала
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5299,00
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Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects
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Published |
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На языке оригинала
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2477,00
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Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection
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Published |
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На языке оригинала
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2477,00
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Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence
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Published |
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На языке оригинала
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2477,00
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Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application
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Published |
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На языке оригинала
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2477,00
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Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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Published |
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На языке оригинала
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1786,00
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Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
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Published |
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На языке оригинала
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2189,00
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Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
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Published |
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На языке оригинала
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1786,00
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Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators
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Published |
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На языке оригинала
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3398,00
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Micro-electromechanical systems（MEMS）technology—Technical specification of automotive grade pressure sensor based on MEMS technology
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Published |
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На языке оригинала
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2189,00
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Micro-electromechanical systems (MEMS) technologyдёЂMicro-pillar compression test for MEMS materials
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Published |
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На языке оригинала
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2189,00
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