Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
|
Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified,woven E-glass reinforced laminated sheets of defined flammability(vertical burning test), copper-clad
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Base materials for printed circuits - Part 1: Test methods
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Base materials for printed circuits - Part 2:Specifications No.11:Thin epoxide woven glass fabric copper - clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2 : Generic requirements
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed boards and printed board assemblies - Design and use - Part 5 - 1:Attachment(land/joint) considerations - Generic requirements
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed boards and printed board assemblies - Design and use - Part 7:Electronic component zero orientation for CAD library construction
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent(500 MHz to 10 GHz)
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2:Test methods for materials for interconnection structures
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3:Test methods for interconnection structures(printed boards)
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Test methods for electrical materials, interconnection structures and assemblies - Part 5:Test methods for printed board assemblies
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
Страницы: 1 / 2 / 3 / 4 |