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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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Environmental testing - Part 2 - 58:Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD)
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Environmental testing - Part 2-69: Tests - Test Te/Tc:Solderability testing of electronic components and printed boards by the wetting balance(force measurement) method
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Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
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Printed boards and printed board assemblies - Design and use - Part 5 - 1:Attachment(land/joint) considerations - Generic requirements
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Attachment materials for electronic assembly - Part 1 - 1:Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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Workmanship requirements for soldered electronic assemblies - Part 3:Through-hole mount assemblies
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Workmanship requirements for soldered electronic assemblies - Part 4:Terminal assemblies
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Workmanship requirements for soldered electronic assemblies - Part 5:Rework, modification and repair of soldered electronic assemblies
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Quality assessment systems - Part 1:Registration and analysis of defects on printed board assemblies
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Quality assessment systems - Part 2:Selection and use of sampling plans for inspection of electronic components and packages
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1 - 1:Pull strength test
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
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Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
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Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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