Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Technical guidelines for river ecological security assessment
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Published |
На языке оригинала
|
3110,00
|
|
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Technical guidelines for evaluation of the aquatic ecological health
|
Published |
На языке оригинала
|
4378,00
|
|
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Guidelines for evaluation of water saving industrial parks
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Published |
На языке оригинала
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1670,00
|
|
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Tractor—Automatic assistant steering systems—General technical specification
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Published |
На языке оригинала
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2189,00
|
|
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Metal spinning formability and test methods—Formability, formability indexes and general test code of practice
|
Published |
На языке оригинала
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2477,00
|
|
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Non-destructive testing—Guided wave testing of ultrasonic phased array cylindrical imaging
|
Published |
На языке оригинала
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2189,00
|
|
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Additive manufacturing—Requirements for data quality of three-dimensional process model
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Published |
На языке оригинала
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1670,00
|
|
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Heavy mechanical—Design specification for weldments
|
Published |
На языке оригинала
|
3110,00
|
|
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Additive manufacturing—Supperalloy powder used for laser powder bed fusion
|
Published |
На языке оригинала
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1786,00
|
|
|
Full locked cable for building structures
|
Published |
На языке оригинала
|
3110,00
|
|
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Test method for protective agents for heating system
|
Published |
На языке оригинала
|
1786,00
|
|
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Test methods for foamed concrete and its products
|
Published |
На языке оригинала
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2822,00
|
|
|
Rectorite
|
Published |
На языке оригинала
|
2189,00
|
|
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Sintered neodymium iron boron permanent magnets—Steady state damp heat tests
|
Published |
На языке оригинала
|
2189,00
|
|
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Radio frequency identification (RFID) tyre tags
|
Published |
На языке оригинала
|
2189,00
|
|
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Steel wire ropes—Creep testing method
|
Published |
На языке оригинала
|
1382,00
|
|
|
Thermal preinsulated ductile iron pipes, fittings and accessories
|
Published |
На языке оригинала
|
3110,00
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects
|
Published |
На языке оригинала
|
2477,00
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection
|
Published |
На языке оригинала
|
2477,00
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence
|
Published |
На языке оригинала
|
2477,00
|
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