| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
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Published |
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На языке оригинала
|
3398,00
|
|
|
|
Vocabulary of electronic tubes
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Published |
|
На языке оригинала
|
10829,00
|
|
|
|
Test methods of printed boards
|
Published |
|
На языке оригинала
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4954,00
|
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|
|
General rules for rigid copper clad laminates for printed circuits
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Test methods for rigid copper clad laminates for printed circuits board
|
Published |
|
На языке оригинала
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6797,00
|
|
|
|
Phenolic celluloss paper copper clad laminated sheets for printed circuit
|
Published |
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На языке оригинала
|
1670,00
|
|
|
|
Composite base copper clad laminated sheets for printed circuits
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
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Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
|
Published |
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На языке оригинала
|
1670,00
|
|
|
|
Grading capacitors for high-voltage alternating current circuit-breakers—Part 1: General
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
The type designation for lasers
|
Published |
|
На языке оригинала
|
1382,00
|
|
|
|
Generic specification for fixed metallized paper dielectric capacitors for direct current
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
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Semiconductor devices―Mechanical and climatic test methods―Part 1: General
|
Published |
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На языке оригинала
|
1382,00
|
|
|
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Semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure
|
Published |
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На языке оригинала
|
1382,00
|
|
|
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Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination
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Published |
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На языке оригинала
|
1382,00
|
|
|
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
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Published |
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На языке оригинала
|
1382,00
|
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Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
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Published |
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На языке оригинала
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1382,00
|
|
|
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Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
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Published |
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На языке оригинала
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1382,00
|
|
|
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Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
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Published |
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На языке оригинала
|
1382,00
|
|
|
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Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）
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Published |
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На языке оригинала
|
1786,00
|
|
|
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Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
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Published |
|
На языке оригинала
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1382,00
|
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