| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
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Published |
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На языке оригинала
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2822,00
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Terminology of packages for semiconductor inte-grated circuits
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Published |
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На языке оригинала
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1786,00
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General principles of measuring methods of V/F and F/V converters for semiconductor integrated circuits
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Published |
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На языке оригинала
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2189,00
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General principles of measuring methods of Sample/Hold amplifiers for semiconductor integrated circuits
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Published |
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На языке оригинала
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1786,00
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Blankdetail specification for semiconductor inte-grated circuit fusible-link programmable bipolar read-only memories
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Published |
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На языке оригинала
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1786,00
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Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
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Published |
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На языке оригинала
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1670,00
|
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Case outlines for film integrated circuits and hybrid integrated circuits
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Published |
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На языке оригинала
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3398,00
|
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Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package
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Published |
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На языке оригинала
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2189,00
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Semiconductor integrated circuits—Specification of DIP leadframes produced by etching
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Published |
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На языке оригинала
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1670,00
|
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Semiconductor integrated circuits—Specification of leadframes for small outline package
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Published |
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На языке оригинала
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1786,00
|
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Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
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Published |
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На языке оригинала
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3744,00
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Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
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Published |
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На языке оригинала
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2189,00
|
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Semiconductor devices--Integrated circuits--Part 1:General
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Published |
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На языке оригинала
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2477,00
|
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Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
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Published |
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На языке оригинала
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3744,00
|
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Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
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Published |
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На языке оригинала
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1670,00
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Specification for round quartz photomask substrates
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Published |
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На языке оригинала
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1670,00
|
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Specification for registration marks for photomasks
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Published |
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На языке оригинала
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1382,00
|
|
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Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
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Published |
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На языке оригинала
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2189,00
|
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Test method of measuring the lead-to-lead and loading capacitance of package leads
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Published |
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На языке оригинала
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1382,00
|
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Specification for photoresist/E-beam resist for hard surface photoplates
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Published |
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На языке оригинала
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1670,00
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| Страницы: 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 |