| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
|
|
Quality and technical requirements for metal packages used for integrated circuits
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
General specification for microwave integrated circuit chip for aerospace
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
4 Mb/s digital time division command/response multiplex data bus test plan
|
Published |
|
На языке оригинала
|
5933,00
|
|
|
|
Microwave circuits—Measuring methods for limiter
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Integrated circuit 3D packaging— Requirement for die stack process and evaluation
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Guideline for intellectual property(IP) core protection
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
General requirements for integral substrate of System in Packageпј€SiPпј‰
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Design assurance guidelines for complex integrated circuits
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Terminology of system in packgaeпј€SiPпј‰
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Integrated circuits—EMC evaluation of transceivers—Part 1:General conditions and definitions
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
EMC IC modelling—Part 1:General modelling framework
|
Published |
|
На языке оригинала
|
5587,00
|
|
|
|
Integrated circuit TSV 3D package reliability test methods guideline
|
Published |
|
На языке оригинала
|
1670,00
|
|
| Страницы: 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 |