Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Measuring Methods for Light Emitting Diodes (for Indication)
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General Rules for Reliability Assured Analogue Semiconducter Integrated Circuits
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Reliability Assured Monolithic Operational Amplifier
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Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified,woven E-glass reinforced laminated sheets of defined flammability(vertical burning test), copper-clad
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International electrotechnical vocabulary - Part 114: Electrochemistry
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Semiconductor devices and integrated circuits
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International electrotechnical vocabulary - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
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International Electrotechnical Vocabulary - Part 581: Electromechanical components for electronic equipment
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International electrotechnical vocabulary - Part 702:Oscillations, signals and related devices
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Marking codes for resistors and capacitors
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Preferred number series for resistors and capacitors
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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Environmental testing - Part 2-42: Tests - Test Kc: Sulphur dioxide test for contacts and connections
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Environmental testing - Part 2-43: Tests - Test Kd: Hydrogen sulphide test for contacts and connections
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Environmental testing - Part 2 - 54:Tests - Test Ta:Solderability testing of electronic components by the wetting balance method
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Environmental testing - Part 2 - 58:Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD)
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Environmental testing - Part 2-69: Tests - Test Te/Tc:Solderability testing of electronic components and printed boards by the wetting balance(force measurement) method
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Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
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