| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Materials for printed boards and other interconnecting structures - Part 2-36:Reinforced base materials clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-37:Reinforced base materials, clad and unclad - Modified non-halogenated expoide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-38:Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 3-1:Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)
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Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
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Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
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Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
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Materials for printed boards and other interconnecting structures - Part 4-1:Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
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Materials for printed boards and other interconnecting structures - Part 4-14:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-15:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-16:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test), for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-17:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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Material for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
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Material for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
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Printed boards - Part 1:Generic specification
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Printed boards - Part 4:Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1:Capability Detail Specification - Performance levels A, B, and C
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Printed boards - Part 4:Rigid multilayer printed boards with interlayer connections - Sectional specification
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Printed boards - Part 14:Device embedded substrate - Terminology/reliability/design guide
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Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits
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