| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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Device embedded substrate - Part 1-1: Generic specification - Test methods
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Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
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Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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Printed electronics - Part 201: Materials - Substrates
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Printed electronics - Part 202: Materials - Conductive ink
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Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films Contactless method
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Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
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Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
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Printed electronics - Part 401: Printability - Overview
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Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
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Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
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Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
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Test method for mechanical property of flexible opto – electric circuit boards under thermal stress
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Base materials for printed circuits - Part 2:Specifications No.11:Thin epoxide woven glass fabric copper - clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
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Device embedded substrate - Part 2-2: Guidelines - Electrical testing
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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
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Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO Level in the electronic assembly technology industries
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