| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
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Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test
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Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
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Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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Electronics assembly technology - Electronic modules
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Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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Device embedded substrate - Part 1-1: Generic specification - Test methods
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Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
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Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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Device embedded substrate - Part 2-2: Guidelines - Electrical testing
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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
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Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO Level in the electronic assembly technology industries
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Device embedded substrate - Part 2-1: Guidelines - General description of technology
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Device embedded substrate - Part 2-3: Guidelines - Design guide
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Device embedded substrate - Part 2-4: Guidelines - Test element groups(TEG)
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