| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Printed boards and printed board assemblies - Design and use -- Part 7: Electronic component zero orientation for CAD library construction ( IEC 61188-7:2017) (german version)
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На немецком языке
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Printed boards and printed board assemblies - Design and use -- Part 7: Electronic component zero orientation for CAD library construction ( IEC 61188-7:2017) (english version)
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На английском языке
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) ( IEC 61189-2-719:2016) (german version)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) ( IEC 61189-2-719:2016) (english version)
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На английском языке
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (english version)
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На английском языке
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (german version)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies ( IEC 61189-5-1:2016) (english version)
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На английском языке
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies ( IEC 61189-5-1:2016) (german version)
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На немецком языке
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Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017) (english version)
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На английском языке
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Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017) (german version)
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На немецком языке
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Materials for printed boards and other interconnecting structures -- Part 2-43: Reinforced base materials clad and unclad – Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ( IEC 61249-2-43:2016) (german version)
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На немецком языке
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Materials for printed boards and other interconnecting structures -- Part 2-43: Reinforced base materials clad and unclad – Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ( IEC 61249-2-43:2016) (english version)
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На английском языке
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Materials for printed boards and other interconnecting structures -- Part 2-44: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ( IEC 61249-2-44:2016) (english version)
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На английском языке
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Materials for printed boards and other interconnecting structures -- Part 2-44: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly ( IEC 61249-2-44:2016) (german version)
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Printed boards -- Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016) (english version)
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На английском языке
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Printed boards -- Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016) (german version)
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Printed boards and printed board assemblies - Design and use -- Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design ((IEC 61188-6-4:2019) EN IEC 61188-6-4:2019) (english version)
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На английском языке
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Printed boards and printed board assemblies - Design and use -- Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design ((IEC 61188-6-4:2019) EN IEC 61188-6-4:2019) (german version)
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На немецком языке
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Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning ((IEC 61189-2-630:2018) EN IEC 61189-2-630:2018) (german version)
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На немецком языке
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Test methods for electrical materials, printed board and other interconnection structures and assemblies -- Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning ((IEC 61189-2-630:2018) EN IEC 61189-2-630:2018) (english version)
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На английском языке
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