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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits Section 7:Blank detail specification for integrated circuits fusible - link programmable bipolar read - only memories
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits - Section 8:Blank detail specification for integrated circuits static read/write memories
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits - Section 9:Blank detail specification for MOS ultraviolet light erasable electrically programmable read - only memories
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Semiconductor devices - Integrated circuits - Part 2 - 11:Digital integrated circuits - Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read - only memory
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Semiconductor devices - Integrated circuits - Part 2:Digital integrated circuits - Section 12:Digital integrated circuits - Blank detail specification for programmable logic devices(PLDs)
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Semiconductor devices - Integrated circuits - Part 3:Analogue integrated circuits - Section 1:Blank detail specification for monolithic integrated operational amplifiers
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Semiconductor devices - Integrated circuits Part 3:Analogue integrated circuits
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Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
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Semiconductor devices - Mechanical and climatic test methods - Part 1:General
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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state,highly accelerated stress test(HAST)
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
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Semiconductor devices - Mechanical and climatic test methods - Part 8:Sealing
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Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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