Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018) (english version)
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Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018) (german version)
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На немецком языке
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Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) (german version)
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На немецком языке
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Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016) (english version)
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На английском языке
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Semiconductor devices -- Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 + A1:2007 + A2:2017) (english version)
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На английском языке
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Semiconductor devices -- Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 + A1:2007 + A2:2017) (german version)
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На немецком языке
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Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017) (german version)
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На немецком языке
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Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017) (english version)
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На английском языке
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Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017) (english version)
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На английском языке
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Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017) (german version)
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На немецком языке
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Semiconductor devices -- Part 16-5: Microwave integrated circuits - Oscillators (german version)
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Semiconductor devices -- Part 16-5: Microwave integrated circuits - Oscillators (english version)
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На английском языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination (IEC 60749-3:2017) (german version)
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На немецком языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination (IEC 60749-3:2017) (english version)
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На английском языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017) (english version)
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На английском языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017) (german version)
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На немецком языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017) (german version)
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На немецком языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017) (english version)
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На английском языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature (IEC 60749-6:2017) (german version)
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На немецком языке
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Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature (IEC 60749-6:2017) (english version)
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