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General Rules for Reliability Assured Analogue Semiconducter Integrated Circuits
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Semiconductor devices - Integrated circuits - Part 1: General
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Semiconductor integrated circuits - Part 2:Digital integrated circuits Section One:Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
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Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 2: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
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Semiconductor integrated circuits - Part 2:Digital integrated circuits Section 10 - Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
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Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
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Semiconductor devices - integrated circuits - Part 2:Digital integrated circuits
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Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters(DAC)
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Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters(ADC)
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Semiconductor devices - Integrated circuits - Part 4:Interface integrated circuits
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Semiconductor devices - Integrated circuits - Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
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Semiconductor devices - Integrated circuits - Part 11 - 1:Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
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Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
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Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
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Semiconductor devices - Integrated circuits - Part 23 - 1:Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
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Semiconductor devices - Integrated circuits - Part 23 - 3:Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers’ self - audit checklist and report
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Integrated circuits - Manufacturing line approval application guideline
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Integrated circuits - Measurements of electromagnetic emissions, 150 kHz to 1 GHz - Part 4:Measurement of conducted emissions - 1 W/150 W direct coupling method
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Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
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Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
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